常用的单片机体系RAM测验方法 LED被称为第四代照明光源或绿色光源，具有节能、环保、寿命长、体积小等特色，能够广泛运用于各种指示、显现、装饰、背光源、一般照明和城市夜景等范畴。这些年，世界上一些经济发达国家环绕LED的研制展开了剧烈的技能竞赛。
LED microcontroller system RAM test methods commonly used is called the fourth generation light source or green light, energy saving, environmental protection, long life, small size and other characteristics, can be widely used in various directions, display, decoration, backlight, general lighting and city lights etc.. Over the years, some of the world's developed countries around the development of LED launched a fierce skills competition.
出光率决议LED光源运用程度
The light output rate is used to determine the LED light source
LED灯具与传统灯具有完全不一样的构造，并且构造对发挥其特性有着关健效果，现代LED灯具首要由LED光源、光学体系、驱动性器、散热器、规范灯具接口等五有些构成。
LED lamp with the traditional lamp structure is completely different, and the structure is Guan Jian effect to play its characteristics, modern LED lamps mainly by LED light source, optical system, radiator, lamps, driving organ specification interface five some form.
德国量一的芯片内经过在硅胶中掺入纳米荧光粉可使折射率进步到1.8以上，下降光散射，进步LED出光功率并有用改进了光色质量。一般荧光粉尺度在1um 以上折射率大于或等于1.85，而硅胶折射率一般为1.5左右，因为两者同折射率的不匹配以及荧光粉颗粒尺度远大于光散射极限(30 nm)，因而荧光粉颗粒外表存在光散射，下降了出光率。
Germany, the amount of a chip in the silica gel after the incorporation of nano phosphors can make the refractive index increased to more than 1.8, decreased light scattering, improve the LED out of power and improve the quality of light and color. The general fluorescent powder scale in the 1um above the refractive index is greater than or equal to 1.85, and the refractive index of silica gel is generally around 1.5, because both refractive index mismatch and phosphor particle size is much larger than the optical scattering limit (30 nm), the phosphor particles are surface light scattering, reduced light rate.
现在白光LED首要经过三种方法完成：
White LED is now basically completed in three ways:
1、选用红、绿、蓝三色LED组合发光即多芯片白光LED；
1, the use of red, green, blue color LED combination light-emitting multi chip white LED;
2、选用蓝光LED芯片和$荧光粉，由蓝光和黄光两色互补得到白光或用蓝光LED芯片合作赤色和绿色荧光粉，由芯片宣布的蓝光、荧光粉宣布的红光和绿光三色混合取得白光；
2, the blue LED chip and $phosphor by the blue light and yellow and white or white with blue are complementary LED chip Cooperation red and green fluorescent powder, blue phosphor powder, announced by the chip announced the red and green colors have mixed white light;
3、运用紫外LED芯片宣布的近紫外激起三基色荧光粉得到白光。
3, the use of ultraviolet LED chip announced near UV excitation of three primary phosphor to get white light.
现在运用广泛的是第二种方法，选用蓝光LED芯片和荧光粉，互补得到白光。因而，此种芯片进步LED的流明功率，决议于蓝光芯片的初始光通量及光坚持率。
Now widely used are second methods, the use of blue chip LED and fluorescent powder, complementary to get white light. As a result, this chip improves the lumen power of LED, which is determined by the initial luminous flux and optical adherence rate of the blue chip.
而蓝光LED芯片的初始光通量是随着外延及衬底技能发展而进步的。光通坚持率则光经过封装技能进行坚持的，坚持光通坚持率的要害在于改进导电及散热内环境，这就涉及到LED封装的要害技能：低热阻封装技术和高取光率封装构造与技术。
The initial luminous flux of blue chip LED is developed with the development of epitaxy and substrate technology. The rate of light flux adhere to the package through skills to adhere to, adhere to adhere to the key is to improve the luminous flux rate of conductive and heat dissipation in the environment, which involves the key skills of LED packaging: packaging technology and low thermal resistance and high light taking rate packaging structure and technology.
就现在来讲，现有LED光效水平，因为输入电能的80%转化为热量，因而芯片散热热量非常要害。LED封装热阻首要包含资料内部热阻和界面热阻。散热基极的效果首要是吸收芯片发生的热量，并传导到热阻上，完成与外界的热交换；而削减界面和界面触摸热阻，增强散热也是要害，因而芯片和散热基极的热界面资料挑选非常重要，现在选用低温或共晶焊膏或银胶。德国量一照明运用的LED芯片内运用的导热胶是内掺纳米颗粒的导热胶，有用进步了界面传热，削减了界面热阻，加快了LED芯片的散热。
For now, the existing LED light efficiency level, because the input of 80% of the energy into heat, so the chip heat dissipation is very important. LED package thermal resistance mainly includes internal thermal resistance and interface thermal resistance. The effect of heat absorption is the main base of chip heat conduction to heat resistance, complete heat exchange with the outside world; and cut the interface and interface thermal resistance, enhanced heat dissipation is crucial, so the chip and radiating base thermal interface material selection is very important, now selected by low temperature or eutectic solder paste or silver glue. The amount of heat conduction glue used in the LED chip is a kind of heat conductive adhesive which is mixed with nano particles, which can improve the interface heat transfer, reduce the interface thermal resistance and accelerate the cooling of the LED chip.
在LED运用过程中，辐射复合发生的光子在向外发射时发生的丢失，首要有三个方面：
In the process of using LED, the loss of the photons emitted by the radiative recombination occurs in the outward emission, which has three aspects:
1、芯片内部构造缺点以及资料的吸收，光子在出射界面因为折射率差导致的反射丢失；
1, the internal structure of the chip, as well as the absorption of the data, photons in the exit interface because of the refractive index difference caused by the loss of reflection;
2、因为入射角大于全反射临界角而引出的全反射丢失；
2, because the incident angle is greater than the total reflection critical angle, the total reflection loss;
3、经过在芯片外表掩盖一层折射率相对较高的透明胶层有用削减光子在界面的丢失，进步了取光率。
3, after the mask in the chip to cover a relatively high refractive index of the transparent layer to reduce the loss of photons in the interface, improve the light extraction rate.
因而请求其有透光率高，折射率高，热稳定性好，流动性好，易于喷涂，同是为进步LED封装的可靠性它请求具有低吸湿性，低应力耐老化等特性。并且一般白光LED还需要芯片所发的蓝光激起荧光粉合成发光，在封装胶内还需参加荧光粉进行配比混色，因而荧光粉的激起功率和变换功率是高光效的要害。
Therefore, the utility model has the advantages of high light transmittance, high refractive index, good thermal stability, good fluidity and easy spraying. The utility model is used for improving the reliability of the LED package. And the general white LED also required the blue chip bioluminescent synthesis of fluorescent powder, the packaging adhesive also need to participate in the fluorescent powder ratio and color mixing, fluorescent powder stirred power and high efficiency is the key power transform.

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